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         Electronic Engineer:     more books (100)
  1. Applications of Experimental Mechanics of Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, ... 1997, Dallas, Texas (Eep (Series), Vol. 22.) by Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta, 1997-01
  2. 2009 IEEE 59th Electronic Components and Technology Conference (Ectc 2009)

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